PCB Assembly PCB Manufacturer - Hitech Circuits

Aluminium LED PCB Board manufacturing Aluminum PCB, or Aluminium PCB, also called Alu PCB, is one of Insulated Metal Substrate (IMS) PCBs, and is also one of the most commonly used Metal Core PCBs (MCPCB) nowadays. HitechPCB manufactures Aluminum printed circuit boards (PCB) with a full selection of high-performance substrates, and we work to be the best aluminum PCB manufacturer and provider no matter you need prototypes or high-volume production quantities. Aluminum PCBs typically are single-sided, but also can be double-sided as well. While, multilayer Aluminum PCBs are highly difficult to manufacture.   Thermal conductivity and thermal resistance of Aluminum LED PCB As a widely used electronic component Aluminum LED PCB's thermal conductivity and thermal resistance are of great significance. The thermal conductivity of led Aluminum LED PCB is the quantity describing the conductor's ability to conduct heat, which can reflect the material's ability to conduct heat. Thermal resistance refers to the change rate of the temperature difference between the two surfaces during the heat conduction process of the surface of the object. In the design and application of electronic components, the thermal conductivity and thermal resistance of led Aluminum LED PCB play a decisive role. Due to the different structure and composition of led Aluminum LED PCB, its thermal conductivity and thermal resistance will be different. Generally speaking, the greater the thermal conductivity of the led Aluminum LED PCB, the stronger the heat conductivity of the surface; And the smaller the thermal resistance, the smaller the temperature difference between the two surfaces. To sum up, the thermal conductivity and thermal resistance of led Aluminum LED PCB are very important parameters, which can affect the performance and service life of electronic components. For different application requirements, the thermal conductivity and thermal resistance of led Aluminum LED PCB will be different. For example, in high temperature environments, Aluminum LED PCB with low thermal resistance and high thermal conductivity should be used; On the contrary, if it is in a low temperature environment, the Aluminum LED PCB with large thermal resistance and small thermal conductivity should be selected. Therefore, in the process of design and application, the thermal conductivity and thermal resistance of Aluminum LED PCB should be selected scientifically and reasonably according to the actual use environment and demand, so as to obtain better use effect. Hitech can provide a wide range of aluminum-based LED PCBS to suit customer requirements.   The relationship between insulating layer thickness and pressure resistance of Aluminum LED PCB   Aluminum LED PCB is a kind of basic material widely used in the field of electronics. The selection and thickness of insulating layer must be considered in the production process. Insulation layer is an important part of Aluminum LED PCB, its role is to prevent short circuit and leakage between different components on the circuit board, so as to ensure the normal operation of the entire circuit. The thickness of insulation layer is very important to the performance of Aluminum LED PCB and is closely related to the voltage it can withstand. In general, the thicker the insulating layer of Aluminum LED PCB, the higher the voltage it can withstand. Because the thicker the insulation, the better you can isolate the different components on the board, reducing the possibility of short circuits and leakage. In addition, the thickness of the insulation layer can also affect the durability and stability of the Aluminum LED PCB, making it more durable and reliable. However, too thick insulation can also bring unnecessary costs and manufacturing difficulties. Therefore, factors such as cost, reliability and performance must be considered comprehensively when selecting insulation layer thickness. Generally, the insulating layer thickness of Aluminum LED PCB should be between 5mil and 10mil, but can be adjusted for specific application requirements. For higher voltage requirements, a thicker insulation layer should be selected to ensure the stability and safety of the circuit board. In summary, the insulating layer thickness of Aluminum LED PCB is closely related to its pressure resistance. Choosing the appropriate insulating layer thickness can improve the safety, stability and reliability of Aluminum LED PCB, so as to ensure the normal operation of the entire circuit. However, in the process of production, it is necessary to consider cost and performance factors to choose the most appropriate insulation layer thickness. https://www.htmpcb.com/aluminium-pcb-c-1.html https://www.hitechpcba.com/led-pcb-board-manufacturing https://hitechcircuits.com/  

What is a high density PCB board (HDI PCB)? The HDI board is based on the traditional double panel as the core board, which is made by continuously accumulating. This circuit board made by a continuous layer is also called the Build-Up Multilayer (BUM). Compared with the traditional circuit board, the HDI circuit board has the advantages of "light, thin, short, small". The electrical connection between HDI's plate layer is achieved by conductive pores, buried holes, and blind holes. Its structure is different from ordinary multi -layer circuit boards. A large number of blind holes are used in HDI boards. HDI PCB uses laser direct drilling, and standard PCB usually uses mechanical drilling, so the number of layers and high width ratio often decreases.   HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor.     High-density interconnect (HDI) PCBs are characterized by finer lines, closer spaces, and more dense wiring, which allow for a faster connection while reducing the size and bulk of a project. These boards also feature blind and buried vias, laser ablated microvias, sequential lamination, and via in-pads. As a result, a HDI board can house the functionality of the previous boards used. HITECH CIRCUITS is an HDI PCB manufacturer and provider in Shenzhen, China supports HDI PCB prototype and mass production with less expensive price and quick-turn lead time. Customers from a variety of industries we serve have a common that have high expectations in quality, reliability and on-time delivery in HDI PCB production. Our quality is not afterthought, but built into each process from front-end to fabrication and shipping. HDI PCB's advantages 1. Reduce PCB cost: When the density of PCB increases beyond the eight-layer board, it will be manufactured in HDI, and the cost will be lower than that of traditional complicated press-forming process. 2. Better reliability: Due to the thin thickness and the aspect ratio of 1:1, the micropores have higher reliability when transmitting signals than ordinary through holes. 3. Improves thermal properties: The insulating dielectric material of the HDI board has a higher glass transition temperature (Tg) and therefore has better thermal properties. 4. Improve RF interference / electromagnetic interference / electrostatic discharge (RFI / EMI ) 5. Increase design efficiency: Micro-hole technology allows the circuit to be arranged in the inner layer, so that the circuit designer has more design space, so the efficiency of the line design can be higher. HDI PCB Manufacturing Process The overall process for manufacturing HDI PCB is essentially the same as for fabricating other PCB board, with notable differences for PCB stack-up and hole drilling. Since HDI boards generally require smaller drill holes for vias, laser drilling is usually required. Although laser drills can produce smaller and more precise holes, they are limited by depth. Therefore, a limited number of layers can be drilled through at a time. For HDI boards, which are invariably multilayer and may contain buried and blind vias, multiple drilling processes may be required. This necessitates successive layer boding to achieve the desired stack-up or sequential lamination cycles. Not surprisingly, this can significantly increase PCB manufacturing time and cost. HDI PCB fabrication is an advanced technology and therefore requires expertise along with specialized equipment like laser drills, laser direct imaging (LDI) capability, and special clean room environments. In order to efficiently manufacture high-quality and reliable HDI PCB products, you must understand the HDI board manufacturing process and coordinate with your HDI PCB supplier to implement good DFM (Design for Manufacturability) for HDI layout design. Therefore, not all board factories have the ability to do the HDI, but Hitechpcb can, we will be here to support our customer needs. -Consumer Driven Technology The via - in - pad process supports  More technology on fewer layers, proving that bigger is not always better. Since the late 1980's we have seen video cameras using cartridges the size of a novel, shrink to fit in the palm of your hand. Mobile computing and work at home have further promoted technology to make the computer faster and lighter, allowing consumers to do remote work from anywhere HDI technology is the main reason for these changes. The products do more, weigh less, and their bodies are smaller. Professional equipment, mini components and thinner materials reduce the size of electronic equipment, while expanding technology, quality and speed.   HDI pcb is the abbreviation for High Density Interconnect pcb or High Density pcb. An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. Hitech Circuits Co., Limited is a professional high density interconnect pcbs, hdi pcb board manufacturer, supplier and design company from China, if you are looking for reliable high density interconnect PCb board partner from China, please don’t hesitate to contact [email protected]  https://hitechcircuits.com/pcb-products/high-density-interconnect-pcb/ https://www.hitechpcba.com/hdi-pcb-manufacturer-high-interconnect-pcb-manufacturing  

As leading one-stop PCB Assembly services provider in China, Hitech Group offers high quality, cost effective, express PCB board products and provides PCB manufacturing, electronics assembly manufacturing, components sourcing, Box build assembly and PCBA testing services for our customers.   For low volume PCB assembly projects, our quick turn PCB assembly delivery time goes from 8 hours to 48 hours when components are ready. No matter you are an electrical engineer, a product designer, a system integrator or a maker looking for PCB fabrication and PCB assembly, or PCB manufacturing and assembly, or electronic assembly services (electronic PCB assembly) ,or a low cost PCB assembly house, Hitech Circuits PCB assembly team will be your perfect PCB assembly house in China.   What is PCB Assembly?    It’s the step in the manufacturing process in which you populate a blank board with the electronic components needed to make it into a functional printed circuit board. It’s these components that make a board into the circuit that enables an electronic product to function. PCB assembly typically takes place via one of two processes:   1. Surface-mount technology SMT: SMT stands for “Surface Mount Technology“.  The SMT components are very small sizes and comes in various packages like 0201, 0402, 0603, 1608 packages for resistors and capacitors. Similarly for Integrated circuits ICs we have SOIC, TSSOP, QFP and BGA. The SMT components assembly is very difficult for human hands and can be time taking process so it is mostly done by automated pick and place machine. 2. Through-hole manufacturing   THT: THT stands for “Through hole Technology”. The components with leads and wires, like resistors, capacitors, inductors, PDIP ICs, transformers, transistors, IGBTs, MOSFETS are example. The component has to be inserted on one side of PCB and pulled by leg on other side and cut the leg and solder it. The THT components assembly is usually done by hand soldering and is relatively easy.   Printed Circuit Board Assembly Techniques   There are only two common PCBA techniques available for use by a PCB designer. The methods are:   1. Automated PCB Assembly Techniques Generally, this technique employs the use of state of the art machines, which are fully automatic. For example, the surface mount components are worth positioning with the aid of an automated pick and place machine. Again, reflow soldering is commonly for surface mount components usually done in a reflow oven. An automated solder stencil is also used to apply the solder paste on the PCB. Finally, high tech inspection machines are used to confirm and check the quality of the PCBA. Some of which include: Automated optical inspection machine (AOI), X-ray inspection machines, etc. Above all, due to the precise monitoring, control of soldering, no human input and versatile machines. This technique ensures utmost efficiency, output consistencies, and limits defects.   2. Manual PCB Assembly Techniques This method is favorite for use with through-hole parts, which needs manual placement on the board. Besides, with these through-hole parts, it’s advisable you use wave soldering. Note that in the through- hole assembly process, you need to place the components and electronics on the PCB.   After that, you use wave soldering to solder the leads. Typically, you will need an individual to insert a component into a marked PTH. Once done, transfer the PCB to the next station where the next person will be on standby tasked with fixing another part.   What are the Benefits of SMT PCB Assembly? SMT assembly provides many benefits and some of them are as follows: It can be used to incorporate small components. In SMT, the components can be placed on both sides of the board. It assures high component densities. Fewer holes need to be drilled for surface mounting than through-hole. It require low initial costs and time for setting up the mass production. SMT is the simpler and faster-automated assembly when compared to through-hole. Errors regarding the component placement can be easily rectified.  Surface mount  PCBs feature strong joints, which can easily withstand vibrations.    What are the techniques used in Surface Mount Technology? There are several techniques for the reflow process. After applying the solder paste or a flux mixture on the board and after placing the components, the boards are conveyed to a reflow soldering oven. The techniques used for reflowing soldering include infrared lamps, hot gas convection, fluorocarbon liquids with a high boiling point, and so on. What are the different testing methods used in SMT PCB Assembly?   Hitech Circuits as the PCB assembly manufacturer, we perform the following testing and inspection to ensure the quality of surface mount PCBs. Automated Optical Inspection (AOI): This is performed before and after the soldering to identify the component placement, presence, and solder quality. X-ray Testing: In this type of testing, the operator relies on the X-ray images of the PCB to check the solder joints and lead-less components such as Quad Flat Packs and ball grid arrays, which are generally not visible to naked eyes. In-Circuit Testing (ICT): This method is used to detect manufacturing defects by testing the electrical properties in the SMT Assembly.   What type of files or documents should I send for SMT PCB Assembly?    Gerber Files: The file contains all details of physical board layers including solder masks, copper layers, drill data, legends, and so on.   Bill of Materials (BOM): This contains information on the list of items needed for the PCB manufacturing and the instructions of manufacturing.  Pick and Place File: This file contains information on all components to be used in the PCB design and their rotation and X-Y coordinates.   The whole process of PCB Assembly 1. Bare board loader machine The first step in the PCB assembly is to arrange the bare boards on the rack, and the machine will automatically send the boards one by one into the SMT assembly line.   2. Printing solder paste When PCB on the SMT production line, firstly, we have to print solder paste on it, and the solder paste will be printed on the pads of the PCB. These solder pastes will be melt and solder the electronic parts to the circuit board when it passes through the high-temperature reflow oven. In addition, when testing new products, some people will use film board/adhesive cardboard instead of solder paste, which can increase the efficiency for adjusting the SMT machines.   3. Solder paste inspection machine(SPI) Since the quality of solder paste printing is related to the quality of welding of subsequent parts, some SMT factories will use optical machine to check the quality of solder paste after printed the solder paste in order to ensure stable quality. If there any poorly printed solder paste board, we will wash off the solder paste on it and reprint, or remove the excess solder paste if there is redundant solder paste on it. 4. High speed SMT machine Usually, we will put some small electronic parts (such as small resistors, capacitors, and inductors) to be printed on the circuit board first, and these parts will be slightly stuck by the solder paste just printed on the circuit board, so even if the speed of printing is very fast and the parts on the board will not fall away. But large parts are not suitable for use in such high speed SMT machines, which will slow down the speed of small parts assembly. And the parts will be shifted from the original position due to the rapid movement of the board.   5. Universal SMT machine Universal SMT machine is also known as "slow machine", it will be assembled some large electronic components, such as BGA IC, connectors, etc., these parts need more accurate positions, so the alignment is very important. Use a camera to take a picture to confirm the position of the parts, so the speed is much slower than High speed SMT machine we taked before. Due to the size of the components here, not all of them are packed in tape and reel, and some may be packed in trays or tubes. But if you want the SMT machine to recognize the trays or tube-shaped packaging materials, you must configure an additional machine. Generally, traditional SMT machines are using the principle of suction to move electronic parts, and in order to place the parts successfully, and there must be the flat surface on these electronic components for the suction nozzle of the SMT machine to absorb. However, for some electronic parts don’t have a flat surface for these machines, and it is necessary to order special nozzles for these special-shaped parts, or add a flat tape on the parts, or wear a flat cap for thees electronic parts. 6. Manual parts or visual inspection After assembled all parts by the high speed SMT machine or Universal SMT machine and before going through the high-temperature reflow oven, and we will set up a visual inspection station here and to pick out the deviation parts or missing components boards etc., because we have to use a soldering iron to repair if there are still defectives boards after passing the high-temperature oven, which will affect the quality of the product and will also increase the cost. in addition, for some larger electronic parts or traditional DIP parts or some special reasons cannot be processed by the SMT machine before, they will be manually placed on pcb here. https://hitechcircuits.com/ https://www.hitechpcba.com/pcb-assembly https://www.htmpcb.com/