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What is PCB Assembly?
Pcb Assembly Services | Pcb Manufacturing Services (hitechpcba.com)
It’s the step in the manufacturing process in which you populate a blank board with the electronic components needed to make it into a functional printed circuit board. It’s these components that make a board into the circuit that enables an electronic product to function. PCB assembly typically takes place via one of two processes:
1. Surface-mount technology
SMT: SMT stands for “Surface Mount Technology“. The SMT components are very small sizes and comes in various packages like 0201, 0402, 0603, 1608 packages for resistors and capacitors. Similarly for Integrated circuits ICs we have SOIC, TSSOP, QFP and BGA.
The SMT components assembly is very difficult for human hands and can be time taking process so it is mostly done by automated pick and place machine.
2. Through-hole manufacturing
THT: THT stands for “Through hole Technology”. The components with leads and wires, like resistors, capacitors, inductors, PDIP ICs, transformers, transistors, IGBTs, MOSFETS are example.
The component has to be inserted on one side of PCB and pulled by leg on other side and cut the leg and solder it. The THT components assembly is usually done by hand soldering and is relatively easy.
Printed Circuit Board AssemblyTechniques
There are only two common PCBA techniques available for use by a PCB designer. The methods are:
**1. Automated PCB Assembly Techniques
**
Generally, this technique employs the use of state of the art machines, which are fully automatic. For example, the surface mount components are worth positioning with the aid of an automated pick and place machine.
Again, reflow soldering is commonly for surface mount components usually done in a reflow oven. An automated solder stencil is also used to apply the solder paste on the PCB.
Finally, high tech inspection machines are used to confirm and check the quality of the PCBA. Some of which include: Automated optical inspection machine (AOI), X-ray inspection machines, etc.
Above all, due to the precise monitoring, control of soldering, no human input and versatile machines.
This technique ensures utmost efficiency, output consistencies, and limits defects.
2. Manual PCB Assembly Techniques
This method is favorite for use with through-hole parts, which needs manual placement on the board. Besides, with these through-hole parts, it’s advisable you use wave soldering. Note that in the through- hole assembly process, you need to place the components and electronics on the PCB.
After that, you use wave soldering to solder the leads. Typically, you will need an individual to insert a component into a marked PTH. Once done, transfer the PCB to the next station where the next person will be on standby tasked with fixing another part.
What are the Benefits of SMTPCB Assembly?
SMT assembly provides many benefits and some of them are as follows:
It can be used to incorporate small components.
In SMT, the components can be placed on both sides of the board.
It assures high component densities.
Fewer holes need to be drilled for surface mounting than through-hole.
It require low initial costs and time for setting up the mass production.
SMT is the simpler and faster-automated assembly when compared to through-hole.
Errors regarding the component placement can be easily rectified.
Surface mount PCBs feature strong joints, which can easily withstand vibrations.
What are the techniques used in Surface Mount Technology?
There are several techniques for the reflow process. After applying the solder paste or a flux mixture on the board and after placing the components, the boards are conveyed to a reflow soldering oven. The techniques used for reflowing soldering include infrared lamps, hot gas convection, fluorocarbon liquids with a high boiling point, and so on.
What are the different testing methods used in SMT PCB Assembly?
Hitech Circuits as the PCB assembly manufacturer, we perform the following testing and inspection to ensure the quality of surface mount PCBs.
Automated Optical Inspection (AOI): This is performed before and after the soldering to identify the component placement, presence, and solder quality.
X-ray Testing: In this type of testing, the operator relies on the X-ray images of the PCB to check the solder joints and lead-less components such as Quad Flat Packs and ball grid arrays, which are generally not visible to naked eyes.
In-Circuit Testing (ICT): This method is used to detect manufacturing defects by testing the electrical properties in the SMT Assembly.
What type of files or documents should I send for SMT PCB Assembly?
Gerber Files: The file contains all details of physical board layers including solder masks, copper layers, drill data, legends, and so on.
Bill of Materials (BOM): This contains information on the list of items needed for the PCB manufacturing and the instructions of manufacturing.
Pick and Place File: This file contains information on all components to be used in the PCB design and their rotation and X-Y coordinates.
The whole process ofPCB Assembly
1. Bare board loader machine
The first step in the PCB assembly is to arrange the bare boards on the rack, and the machine will automatically send the boards one by one into the SMT assembly line.
2. Printing solder paste
When PCB on the SMT production line, firstly, we have to print solder paste on it, and the solder paste will be printed on the pads of the PCB. These solder pastes will be melt and solder the electronic parts to the circuit board when it passes through the high-temperature reflow oven.
In addition, when testing new products, some people will use film board/adhesive cardboard instead of solder paste, which can increase the efficiency for adjusting the SMT machines.
3. Solder paste inspection machine(SPI)
Since the quality of solder paste printing is related to the quality of welding of subsequent parts, some SMT factories will use optical machine to check the quality of solder paste after printed the solder paste in order to ensure stable quality. If there any poorly printed solder paste board, we will wash off the solder paste on it and reprint, or remove the excess solder paste if there is redundant solder paste on it.
4. High speed SMT machine
Usually, we will put some small electronic parts (such as small resistors, capacitors, and inductors) to be printed on the circuit board first, and these parts will be slightly stuck by the solder paste just printed on the circuit board, so even if the speed of printing is very fast and the parts on the board will not fall away. But large parts are not suitable for use in such high speed SMT machines, which will slow down the speed of small parts assembly. And the parts will be shifted from the original position due to the rapid movement of the board.
5. Universal SMT machine
Universal SMT machine is also known as "slow machine", it will be assembled some large electronic components, such as BGA IC, connectors, etc., these parts need more accurate positions, so the alignment is very important. Use a camera to take a picture to confirm the position of the parts, so the speed is much slower than High speed SMT machine we taked before. Due to the size of the components here, not all of them are packed in tape and reel, and some may be packed in trays or tubes. But if you want the SMT machine to recognize the trays or tube-shaped packaging materials, you must configure an additional machine.
Generally, traditional SMT machines are using the principle of suction to move electronic parts, and in order to place the parts successfully, and there must be the flat surface on these electronic components for the suction nozzle of the SMT machine to absorb. However, for some electronic parts don’t have a flat surface for these machines, and it is necessary to order special nozzles for these special-shaped parts, or add a flat tape on the parts, or wear a flat cap for thees electronic parts.
6. Manual parts or visual inspection
After assembled all parts by the high speed SMT machine or Universal SMT machine and before going through the high-temperature reflow oven, and we will set up a visual inspection station here and to pick out the deviation parts or missing components boards etc., because we have to use a soldering iron to repair if there are still defectives boards after passing the high-temperature oven, which will affect the quality of the product and will also increase the cost. in addition, for some larger electronic parts or traditional DIP parts or some special reasons cannot be processed by the SMT machine before, they will be manually placed on pcb here.
7. Reflow oven
The purpose of reflow oven is to melt the solder paste and form a non-metallic compound on the component feet and the circuit board, that means to solder electronic components on the circuit board. The temperature rise and fall curves often affect the soldering quality of the entire circuit board. According to the characteristics of the solder materials, usually the reflow oven will set the preheating zone, soaking zone, reflow zone, and cooling zone to achieve the best soldering effect.
For example, the melting point for SAC305 solder paste with lead-free is about 217°C, which means that the temperature of the reflow oven must be higher than the melting points to remelt the solder paste. What's more, the maximum temperature in the reflow furnace should not exceed 250°C, otherwise many parts will be deformed or melted because they cannot withstand such a high temperature.
Basically, after the pcb passed through the reflow oven, the assembly for the entire circuit board is almost complete. If there are hand-soldered parts, we need to transfer to DIP process, and then we have to check the quality after reflow oven by QC department.
8. Automatic optical inspection(AOI)
The main purpose of setting up AOI is because some high density boards can’t be process the following ICT test, so we used AOI inspection to replace it. But even using AOI inspections, there still have the blind spots for such checking, for example, the solder pads under the components cannot be checked by AOI. At present, it can only check whether the parts have side standing issue, missing parts, displacement, polarity direction, solder bridges, lack of soldering etc., but cannot checking the BGA solderability, resistance value, capacitance value, inductance value and other components quality, so far AOI inspection can’t completely replace ICT test.
Therefore, there is still some risk if only AOI inspection is used to replace ICT testing, but ICT test is also not 100% make sure the good quality, we suggest these two ways can be combined with together to make sure the good quality.
9. PCB unloader machine
After the board is fully assembled, it will be retracted to the unloder machine, which has been designed to allow the SMT machine to automatically pick and place the board without damaging the quality for PCB.
10. Visual inspection for finished products
Normally there will be a visual inspection area in our SMT production line whether there is an AOI station or not, and it will help to check if there are any defectives after completed assembled the pcbs. If there is an AOI station, it can reduce the visual inspection worker on our SMT line, and to reduce the potential cost, and because it is still necessary to check some places that cannot be judged by AOI, many SMT factories will provide the mainly visual inspection templates at this station, which is convenient for visual inspection worker to inspect some key parts and polarity for components.
11. DIP process
DIP process is a very important process in the whole PCBA processing, and the processing quality will directly affect the functional for PCBA boards, so it is necessary to pay more attention to the DIP process. There are many preliminary preparations for DIP process. The basic process is to re-process the electronic components first, like to cut the extra pins for some DIP components, our staff received the components according to the BOM list, and will check whether the material part numbers and specifications are correct or not, and performs pre-production pre-processing according to the PCBA samples. The steps are: Use various related equipment (automatic capacitor pins cutting machine, jumper bending machine, diode and triode automatic forming machine, automatic belt forming machine and other machines) for processing.
12. ICT test
Printed Circuit board open/short circuit test (ICT, In-Circuit Test), The purpose of ICT test is mainly to test whether the components and circuits on the printed circuit board are open or short issues. It can also measure the basic characteristics of most components, such as resistance, capacitance, and inductance values to judge whether the functions of these parts are damaged, wrong parts or missing parts etc. after passing through the high-temperature reflow oven.
ICT test machines are divided into advanced and basic machines. The basic ICT test machines are generally called MDA (Manufacturing Defect Analyzer). It’s just to measure the basic characteristics of electronic components and judge open and short circuits issue we talked above.
In addition to all the functions of the basic ICT test machines, for advanced ICT test machine can also test the whole PCBA by using power, start to testing the PCBA boards by setting the program in the test machine. The advantage is that it can simulate the function of the printed circuit board under the actual power-on condition, this test can partly replace the following functional test machine (Function Test). But the cost for the test fixture of this advanced ICT test can probably buy a car, it’s too expensive and we suggest it can be used in mass production products.
13. PCBA function test
Functional testing is to make up for the ICT test, because ICT only tests the open and short circuits on the the PCBA board, and other functions such as BGA and other fuctions are not tested, so it is necessary to use a functional testing machine to test all functions on the whole PCBA board.
14. Cutting board (assembly board de-panel)
Normally, printed circuit boards will be produced in panel, and it will be assembled to increase the efficiency of SMT production. It means several single boards in one panel, such as two-in-one, four-in-one etc. After finished all the pcb assembly process, it needs to be cut into single boards, and for some printed circuit boards with only single boards also need to cut off some redundant board edges.
There are several ways to cut the printed circuit board. You can design the V-cut using the blade cutting machine (Scoring) or directly manually break off the board (not recommended). For more high density circuit boards, it will be used the professional splitting machine or the router to split the board without any damage the electronic components and printed circuit boards, but the cost and working hours will be a little longer.
Why Choose Hitech Circuits PCB Assembly Manufacturer for Your PCB Assembly Projects?
There are several PCB manufacturers specializing in PCB assemblyservices. However, Hitech Circuits PCB Assembly stands out owing to the following:
Assistance in Material Procurement:
Technically, in PCB assembly services, the quality of parts is the responsibility of the OEM; however, we ease your job by assisting you to make the right selection. We can help you procure all your parts of the same type own a single part number, thanks to our supply chain and vendor network as well as experience. This saves time and cost that goes in ordering single parts as you plan.
Testing procedures:
We are very focused on quality and thus implement stringent testing procedures at each stage of the assembly and after completion.
Fast Turnaround Times:
Our well-equipped facility and the right tools enable us to complete your requirements well before time, and without compromising on the quality or functioning of the PCBs. For simple designs we revert in 24 to 48 hours.
Cost Effectiveness:
While PCB assembly is a cost-effective alternative, we go a step further and assure that the parts you list are of a good quality and suitable for your requirement. Also, you can control the part flow and replenish them as needed. This eliminates the need to buy extra stock and store it.
Quick Quote:
We offer a quick quote based on your BOM. All you need is a detailed BOM, Gerber files, your application requirement sheet, and quantity.
We’re not one to stand still, which is why we use the latest equipment and the finest minds to create your PCB projects. We’re constantly keeping our finger on the pulse of the latest trends. And as a result, we know how to deliver the highest standards of PCB assembly to meet all your requirements.
Our dedicated, friendly customer service team also means that we support you every step of the way. Offering our expert guidance to ensure a complete PCB project that you’re happy with.
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Circuit Board Manufacturing & PCB Assembly & Electronic Assembly service & electronics manufacturing company – Hitech Circuits Co., Limited
PCB assembly, electronics manufacturing, electronics assembly manufacturing service company in China (hitechcircuits.com)
As leading one-stop PCB Assembly services provider in China, Hitech Group offers high quality, cost effective and express PCB board products and provides PCB manufacturing, electronics assembly manufacturing, components sourcing, Box build assembly and PCBA testing services for our customers.
For full turn-key circuit board assembly, we take care of the entire process, including Printed Circuit Boards fabrication, components sourcing, order tracking, continuous monitoring of quality and final PCB board assembly. Whereas for partial turn-key, the customer can provide the PCBs and certain components, and the remaining parts will be handled by us.
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What is PCB assembly
The circuit board before the assembly of electric components is called Printed Circuit Board. After the soldering of all the elements on the board, it is known as Printed circuit Board Assembled, we called PCB assembly. The complete process of component’s assembly is called Printed Circuit Assembly or Printed Circuit Board assembly or PCB board assembly. In this process, different automatic and manual assembly tools are used. We are assembler that offer PCB assembly.
What’s the difference between Printed circuit board vs PCB Assembly?
PCB is a printed circuit board because it is made by electronic printing, so it is called a “printed” circuit board. PCB is an important electronic component in the electronic industry, it is electronic base. It is the support of electronic components and the carrier of electrical connection of electronic components. PCB has been widely used in the production of electronic products.
PCB Assembly generally refers to a processing flow, which can also be understood as the finished circuit board, that is, PCBA can only be counted after the processes on the PCB are completed. PCB refers to an empty printed circuit board with no parts on it. The above is the difference between PCB and PCBA.
SMT (surface mounted technology) and DIP (Dual In-line Package) are both ways to integrate parts on the circuit board. The main difference is that SMT does not need to drill holes on PCB, but in dip, it needs to insert the pin into the drilled hole.
SMT mainly uses the mounting machine to mount some micro and small parts on the circuit board. Its production process is PCB positioning, solder paste printing, mounting by the mounting machine, reflow oven, and inspection.
The dip is a “plug-in”, that is to insert parts on the PCB board. It is a kind of plug-in integrated part when some parts are large in size and not suitable for mounting technology. Its main production processes are back glue, plug-in, inspection, wave soldering, plate brushing, and finished inspection.
Flexible Volume PCB Assembly Service
Our PCB assembly services go above and beyond what the average PCB assembly company will do. We offer a variety of flexible circuit board assembly services for the different stages of your product development, including:
• Prototype PCB Assembly: See how well your PCB design works before generating a large order. Our quality prototype PCB assembly allows us to deliver a quick prototype, so you can identify any potential challenges in your design fast and optimize the quality of your final boards.
• Low-Volume, High Mix PCB Assembly: If you require a number of different boards for specialized applications, HitechPCB is your company.
• High-Volume PCB Assembly: We are equally as skilled at cranking out large PCB assembly orders as we are at delivering small ones.
• Consigned & Partial PCB Assembly: Our consigned PCB assembly services meet IPC Class 2 or IPC class 3 standards, are ISO 9001:2015-certified and are RoHS-compliant.
• Full Turnkey PCB Assembly: Also ISO 9001:2015-certified and RoHS-compliant, our turnkey PCB assembly allows us to take care of your entire project from start to finish, so you can step in and start taking advantage of the finished product right away.
From SMD to through-hole and mixed PCB assembly projects, we do it all, including free Valor DFM/DFA checks and function testing to verify the quality of your boards, with no minimum cost requirements or added tooling charges when you reorder.
Hitech Circuits integrates quality ISO certified systems and innovative assembly and packaging technologies to deliver market-leading consumer electronic products. From product assembly through enclosures to testing and packaging, Hitech’s SMT lines utilize the most advanced technologies in the industry including:
Quick turn pcb assembly Flip Chip Technologies
0201 Technology
Lead-Free Solder Technology
Alternative PCB Finishes
Early supplier involvement
Design and engineering support
PCB manufacturing and PCB assembly
Backplane assembly
Memory and optical modules
Cable and harness assembly
Plastic injection molding
Precision machining
Enclosures
Integration of hardware and software
BTO and CTO services according to your needs
Reliability testing
Lean and Six Sigma quality processes
We offer both human and automated PCB assembly services for PCBA Prototype
Our PCB assembly processes use both human and automated services. Larger PCB assembly projects can benefit from the speed and accuracy of our automated service, while PCBA prototypes more detailed work can be checked in-house by one of our expert team members.
Surface Mount Technology assembly (SMT Assembly)
At Hitech, we have capabilities to utilize surface mount technology to assemble your PCBs, using our pick and place machine. We use surface mount assembly technology as it is more cost-efficient and reliable than other, more traditional PCB assembly methods. For example, with SMT assembly more electronics can be included in a smaller space on a PCB. This means PCBs can be customised much more easily and efficiently, and at a much higher volume.
Testing and quality control
To ensure PCB assembly process is fault-free, we use innovative AOI and X-Ray testing and checking. AOI, or automated optical inspection, test PCBs for catastrophic failure and quality defects by autonomously scanning them with a camera. We use automated testing at multiple stages of our PCB assembly process to ensure all our PCBs are of the highest quality.
Our technology
At Hitech, we utilise the latest advancements in technology for our printed circuit board assembly. Just some of the tech and machines we use includes:
• Wave soldering machine
• Pick and place
• AOI & X-Ray
• Automated conformal coating
• SPI machine
FAQs for HiTech Circuits – PCB Assembly Services
1. What services does HiTech Circuits offer related to PCB assembly?
HiTech Circuits specializes in providing comprehensive Printed Circuit Board (PCB) assembly services. This includes surface mount technology (SMT) assembly, through-hole technology (THT) assembly, mixed-technology assembly, prototype assembly, low-to-high volume production, and turnkey solutions. Our services are designed to cater to a wide range of industries, including but not limited to telecommunications, medical devices, automotive, and consumer electronics.
2. Can HiTech Circuits handle the assembly of complex PCBs?
Absolutely! We are equipped with advanced manufacturing technologies and have a skilled team capable of handling complex PCB assemblies. Whether your project involves high-density interconnects (HDI), fine pitch components, or requires specialized soldering techniques, we have the expertise and resources to meet your needs.
3. Does HiTech Circuits offer turnkey PCB assembly services?
Yes, we offer full turnkey PCB assembly services. This means we can manage every step of your project from sourcing components, PCB fabrication, assembly, testing, and final shipment. Our turnkey solution is designed to save you time and reduce the hassle of coordinating with multiple suppliers.
4. What quality certifications does HiTech Circuits hold?
HiTech Circuits is committed to delivering high-quality products. We are certified under ISO 9001 for our quality management system, ensuring that our processes and products meet international standards for quality and reliability.
5. How does HiTech Circuits ensure the quality of PCB assemblies?
We employ a rigorous quality assurance process that includes automated optical inspection (AOI), X-ray inspection, in-circuit testing (ICT), and functional testing to detect and correct any defects or issues. Our quality control measures are in place at every stage of the assembly process to ensure that every PCB assembly meets our high standards and your specific requirements.
6. Can I get a prototype PCB assembly before a full production run?
Yes, prototype PCB assembly is one of our core services. Prototyping allows you to test and refine your designs before moving to mass production. We offer quick turnaround times for prototypes to help accelerate your development cycle.
7. What information do I need to provide for a PCB assembly quote?
For a detailed and accurate quote, please provide us with your PCB design files (Gerber files, BOM (Bill of Materials), assembly drawings, and any specific instructions or requirements you have. Additionally, details about the quantity and timeline for your project will help us provide you with a more precise estimate.
8. How long does it take to receive a quote from HiTech Circuits?
We aim to provide quotes as quickly as possible. Typically, you can expect to receive a detailed quote within 24 to 48 hours after submitting all the necessary documentation and information about your project.
9. Does HiTech Circuits support urgent PCB assembly orders?
Yes, we understand the importance of meeting tight deadlines and can accommodate urgent PCB assembly orders. Please contact us with your specific requirements, and we will do our best to meet your timeline without compromising on quality.
10. How can I track the progress of my PCB assembly order?
We believe in keeping our clients informed every step of the way. Once your order is placed, you will be assigned a project manager who will be your point of contact. You can expect regular updates on the status of your order and are always welcome to contact your project manager for any questions or updates.
As a leading one-stop electronics manufacturing services provider in China, Hitech Circuits Co., Limited offers high quality, cost effective and quick turn PCB board products, Printed Circuit board, PCB assembly, electronics assembly manufacturing, Electronic parts components sourcing services for your new products development.
With mature supply chain, talented design team, advanced manufacturing techniques and quality control systems, Hitech Circuits Co., Limited is able to provide one-stop electronics manufacturing services and solution for our customers to help them stand out in the marketplace.
Circuit Board, PCB assembly & electronics manufacturing service provider from China (hitechcircuits.com)
PCB Assembly
Hitech offer turnkey electronics assembly services, including prototype pcb assembly or low & high volume pcb assembly production. Our PCB assembly service always exceed customer’s expectations for quality, price and delivery. We manage the whole process including ordering PCB manufacturing, sourcing components, PCB assembly, and PCBA testing, etc.
PCB Manufacturing
With over 15 years experience in PCB manufacturing, Hitech Circuits provides the latest printed circuit board manufacturing technologies and highest quality standards for electronics industry. Products including: double sided pcb, flex pcb, rigid-flex pcb, ceramic pcb, aluminum pcb, HDI pcb, high frequency pcb, etc. Choose a reliable PCB manufacturer in China .
Components Sourcing
Hitech Circuits Co., Limited has 10 yeas experience on Electronic Parts purchasing area. With our PCB Assembly business expanding, we added comprehensive electronic components sourcing services to improve our PCB assembly production line efficiency, so that our customers can spare more time on project engineering , designing and optimizing.
https://hitechcircuits.com/
The pcb assembly factory-Hitech also manufactured printed circuit boards with the highest reliability in all industries. Such as aerospace, defense, automotive, medical and other fields.
Technical Parameters
We offer a number of services including traditional PCB assembly and Surface Mount (SMT) assembly. Hitechpcb offers turnkey electronic PCB manufacturing services for the medical, industrial control, audio-visual and many other industries with high reliability requirements. Certified to international production standards, our rapid turnaround PCB assembly and comprehensive box build services cover all phases of the production cycle, from design and manufacturing through to distribution.
Printed Circuit Board Assembly Service
Printed Circuit Board Assembly is one of our major services, Also, HITECHPCB build from rigid pcb, flexible printed circuit boards manufacturing, components sourcing to PCB assembly.
Check out this list of some of the high-quality PCB Assembly Services we offer:
1. One-Stop PCB Fabrication and PCB Assembly:
Quickly, high quality, complicated, a turnkey start-to-finish solution : PCB Manufacturing + Components Sourcing + PCB Assembly + Box Build Assembly+ PCBA Testing, meets all customers’ needs.
2. PCB Assembly Services:
SMT Assembly, THT and Mixed Assembly, Package on Package (POP), Rigid PCBs, Flexible PCBs, Rigid-flex PCBs, HDI PCBs, Aluminium PCB, Ceramic PCB, High Frequency PCBs, Rogers PCB, etc. – if there’s a type of printed circuit board that can be assembled, we almost surely do it.
3. Flexible Volume Assembly Alternatives:
• Prototype PCB Assembly: See how well your PCB design works before generating a large order. Our quality prototype PCB assembly allows us to deliver a quick prototype, so you can identify any potential challenges in your design fast and optimize the quality of your final boards.
• Low-Volume, High Mix PCB Assembly: If you require a number of different boards for specialized applications, HITECHPCB Is your best choice.
• High-Volume PCB Assembly: We are equally as skilled at cranking out large PCB assembly orders as we are at delivering small ones.
• Consigned & Partial PCB Assembly: Our consigned PCB assembly services meet IPC Class 2 and Class 3 standards, are ISO 9001:2015, IATF16949, ISO 14001, UL are RoHS-compliant.
• Full Turnkey PCB Assembly: Our turnkey PCB assembly allows us to take care of your entire project from start to finish, so you can step in and start taking advantage of the finished product right away.
PCB Assembly factory - HiTech Circuits
Aluminium PCB
What’s Aluminium LED PCB?
Aluminum LED PCB substrate is a metal - based copper-clad sheet with good heat dissipation. A single panel is generally composed of three layers of structure, ... View More
What is Heavy Copper PCB?
Heavy copper PCB is a circuit board with a copper thickness that is ≥ 3oz per sq. ft in its outer and inner layers. What makes a circuit board classified as a heavy copper... View More
What is a high density PCB board (HDI PCB)?
The HDI board is based on the traditional double panel as the core board, which is made by continuously accumulating. This circuit board made by a continuous layer is also called the Build-Up Multilayer (BUM). Compared with the traditional circuit board, the HDI circuit board has the advantages of "light, thin, short, small".
The electrical connection between HDI's plate layer is achieved by conductive pores, buried holes, and blind holes. Its structure is different from ordinary multi -layer circuit boards. A large number of blind holes are used in HDI boards. HDI PCB uses laser direct drilling, and standard PCB usually uses mechanical drilling, so the number of layers and high width ratio often decreases.
HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor.
High-density interconnect (HDI) PCBs are characterized by finer lines, closer spaces, and more dense wiring, which allow for a faster connection while reducing the size and bulk of a project. These boards also feature blind and buried vias, laser ablated microvias, sequential lamination, and via in-pads. As a result, a HDI board can house the functionality of the previous boards used. HITECH CIRCUITS is an HDI PCB manufacturer and provider in Shenzhen, China supports HDI PCB prototype and mass production with less expensive price and quick-turn lead time. Customers from a variety of industries we serve have a common that have high expectations in quality, reliability and on-time delivery in HDI PCB production. Our quality is not afterthought, but built into each process from front-end to fabrication and shipping.
HDI PCB's advantages
1. Reduce PCB cost: When the density of PCB increases beyond the eight-layer board, it will be manufactured in HDI, and the cost will be lower than that of traditional complicated press-forming process.
2. Better reliability: Due to the thin thickness and the aspect ratio of 1:1, the micropores have higher reliability when transmitting signals than ordinary through holes.
3. Improves thermal properties: The insulating dielectric material of the HDI board has a higher glass transition temperature (Tg) and therefore has better thermal properties.
4. Improve RF interference / electromagnetic interference / electrostatic discharge (RFI / EMI )
5. Increase design efficiency: Micro-hole technology allows the circuit to be arranged in the inner layer, so that the circuit designer has more design space, so the efficiency of the line design can be higher.
HDI PCB Manufacturing Process
The overall process for manufacturing HDI PCB is essentially the same as for fabricating other PCB board, with notable differences for PCB stack-up and hole drilling. Since HDI boards generally require smaller drill holes for vias, laser drilling is usually required. Although laser drills can produce smaller and more precise holes, they are limited by depth. Therefore, a limited number of layers can be drilled through at a time. For HDI boards, which are invariably multilayer and may contain buried and blind vias, multiple drilling processes may be required. This necessitates successive layer boding to achieve the desired stack-up or sequential lamination cycles. Not surprisingly, this can significantly increase PCB manufacturing time and cost. HDI PCB fabrication is an advanced technology and therefore requires expertise along with specialized equipment like laser drills, laser direct imaging (LDI) capability, and special clean room environments. In order to efficiently manufacture high-quality and reliable HDI PCB products, you must understand the HDI board manufacturing process and coordinate with your HDI PCB supplier to implement good DFM (Design for Manufacturability) for HDI layout design. Therefore, not all board factories have the ability to do the HDI, but Hitechpcb can, we will be here to support our customer needs.
-Consumer Driven Technology
The via - in - pad process supports
More technology on fewer layers, proving that bigger is not always better. Since the late 1980's we have seen video cameras using cartridges the size of a novel, shrink to fit in the palm of your hand. Mobile computing and work at home have further promoted technology to make the computer faster and lighter, allowing consumers to do remote work from anywhere.
HDI technology is the main reason for these changes. The products do more, weigh less, and their bodies are smaller. Professional equipment, mini components and thinner materials reduce the size of electronic equipment, while expanding technology, quality and speed.
-Via in Pad Process
The inspiration from the surface installation technology pushed the restrictions of BGA, COB and CSP to a smaller square surface inch. The via in pad can be placed in the surface of flat land through the cushion process. The via is plated and filled with conductive or non-conductive epoxy resin, and then close and plat it to make it almost invisible.
It sounds simple, but there are eight steps to complete this unique process. Professional equipment and well -trained technicians followed closely to achieve perfect hiding.
-Via Fill Types
There are many different types of via fill materials: non -conductive epoxy, epoxy, copper filling, filling and electrochemical coating. All this leads to via buried in a flat land, and the land will be fully solders as normal land. Vias and mricrovias are drilled, blind or buried, plated, and then hidden under the SMT land. Processing vias of this type of Vias requires special devices and takes time. The process time of multiple drill cycles and controlling deep drills has increased.
-Cost Effective HDI
Although the size of some consumer products is reduced, quality is still the most important factor for consumers. Use HDI technology during the design process, you can reduce the 8-layer through-hole PCB to a 4 layer HDI Microvia technology packed PCB. The elaborate HDI 4-layer PCB wiring function can achieve the same or better functions as standard 8-layer PCB.
Although the Microvia process has increased the cost of HDI PCB, the appropriate design and decrease of layers of counting reduces the cost of the ingredients of the material, and the layer count is large.
-Laser Drill Technology
The smallest micro-vias can provide more technologies on the surface of the plate. Using a beam with a diameter of 20 microns (1 mil), this high impact can be cut through metal and glass to produce tiny via hole. There are new products, such as uniform glass materials, and they are low -loss layer pressure plates and low -dielectric constants. These materials have high heat resistance, can be used for lead -free components, and allows smaller holes.
-Lamination & Materials For HDI PCB Boards
Advanced multilayer technology allows designers to add other layers to form a multilayer PCB. Use laser drills to produce holes in the inner layer, and can be coated when pressed, imaging and etching. The process of this increase is called sequential construction. Hitechpcb HDI PCB manufacturing uses solid -filled VIA can better heat management, connect stronger connection and improve the reliability of the board.
The copper of the resin coating is a assistant with poor pores, with longer drilling time and thinner. Hitechpcb has ultra low contours and ultra thin copper foil, and its surface is fixed on a tiny nodule. This material has chemically treated and started chemical treatment and startup of the most fine and high quality lines and spacing technology.
The dry resistance of the layer pressure plate still uses heating scroll method to apply resistance to core materials. It is now recommended to preheat the material to the required temperature before the layer pressure process of the HDI printing circuit board. The preheating of the material can better apply dry resistance to the surface of the layer pressure plate, pull less calories from the heat roll, and keep the stable export temperature of the layer made products consistent. The consistent entrance and exit temperature cause less air clips under the movie. This is essential for the breeding of fine lines and spacing.
Hdi Pcb - High Interconnect Pcb Manufacturing - Hitechpcba
Teflon PCB
What is high frequency pcb?
As complexity of electronic components increases, the one thing that becomes imperative is signal rates and high frequency of transmission. Little surprise then that the demand for high frequency PCBs is on the rise. They find use in a variety of high-speed design applications that require a frequency range of 500MHz to 2GHz.
FR-4, based on epoxy resin and glass reinforcement, is the most popular laminate material for printed circuit board industry for a long time. The FR4 dielectric constant ranges from 3.8 to 4.8, depending on the glass weave style, thickness, resin content, and copper foil roughness. However, PCB industry also use other material for different application. In RF/microwave products, low loss and special controlled dielectric constant material like PTFE (Teflon) was widely used. These material was developed long time ago. Partly because of low volume in production, it is quite expensive in the past. When wireless became popular in consumer products years ago, the demand for low loss material was went high. But the material cost is still high. Even some new developed material were trying to get involved, it seems none of them can reduce the material cost dramatically. How to reduce the RF PCB cost became an essential problem for the designer. One of the solution is the mixed dielectric design.
Because the low loss material is not needed for all wireless system, it mostly designed-in, from my understanding, for the circuits from antenna to power amplifier. To reduce the PCB cost, designer used multiple PCB and only the front end of the receiver subsystem need high cost low loss material. However, the cost is still high because of multiple PCB’s and the connector between them. Beside, the Teflon PCB is soft and is comparably difficult in assembly due to warpage.
As another kind of high frequency material, Teflon pcb are widely used in wireless networks, wireless communications and satellite communications, in particular the popularity of 3G networks exacerbate the market demand for the product on the HF PCB.
What is Teflon PCB?
Teflon is a brand name for Polytetrafluoroethylene. PTFE is known for its nonstick and non-reactive surface. Teflon is a well-known material used in the manufacturing of several products. Teflon PCB is an electric circuit that is equipped with better capacities and enhanced connections.
Teflon PCB is a synthetic resin material utilized in non-sticky applications. This material is manufactured by polymerizing tetrafluoroethylene. Teflon PCB material can resist high temperatures. Due to this, it is commonly used for high-frequency PCB.
It features properties like low dissipation factor, cold resistance, low coefficient of thermal expansion, chemical resistance, and high heat. Teflon PCB manufacturers design this PCB to offer outstanding advantages to users.
Polytetrafluoroethylene is a material known for its resistance to moisture, grease, chemicals, and oil. PTFE PCB features high lubrication, no adhesion, weather resistance, and high insulation. This material is used in the production of PCB ideal for electronic appliances.
Teflon PCB in high-end electronic products uses Teflon laminate material. The scientific name of Teflon is polytetrafluoroethylene(PTFE).This material is resistant to acids, alkalis, and various organic solvents, and is almost
insoluble in all solvents. At the same time, Teflon material has the characteristics of high-temperature resistance, and its dielectric coefficient is very low, so it is an ideal high-frequency PCB material for high-frequency Teflon PCB
Teflon PCB has a series of excellent performances:
High-temperature resistance: long-term use temperature 200~260 degrees;
Low-temperature resistance: still soft at-100 degrees;
Corrosion resistance: can withstand aqua Regina and all organic solvents:
Weather resistance: the best aging life among plastics,
High lubrication: has the smallest coefficient of friction in plastics (0.04):
Non-sticky: It has the smallest surface tension among solid materials without adhering to any substance?
It is physiologically inert it has excellent electrical properties and is an ideal C-level insulating material. A thick layer of newspaper can block the high voltage of 1500V: it is smoother than ice
Teflon has outstanding excellent comprehensive properties, high-temperature resistance, corrosion resistance, non-stick, self-lubricating, excellent dielectric properties, and a very low coefficient of friction. Among Teflon PCB Teflon is a high-frequency PCB material with very excellent performance. This is very suitable for applications in radar, high-freouency communication equipment, radio equipment and other fields.
Usually in Teflon PCB general manufacturers seldom use this kind of Teflon sheet, we can provide Tefon PCB to meet customers various PCB needs. At present in the manufacture of Teflon PCB for us. Teflon PCB material can achieve 4-6 layers of pure compression: 4~8 lavers of mixed compression.
Teflon Pcb - Teflon Circuit Board - Hitech Circuits (hitechpcba.com)
Ceramic PCB
1. What is Ceramic PCB?
Ceramic PCB board is also called ceramic substrate or ceramic circuit board, ceramic copper coated plate, ceramic substrate refers to the copper foil directly bo... View More
